New Snapdragon 821 Powered Cool Flagship Hits TENAA ~ Mods Firmware

Coolpad and LeEco recently announced the Cool1 Dual smartphone aimed at the mid-range segment. Now, it looks like the collaboration is back with a new Cool device, as it recently passed through the network certification website TENAA.

From the design of this new smartphone, it looks like a variant of the Le Pro 3 that was announced by LeEco a while back. The back texture seems to be a bit different and the writing near the bottom now features Cool’s logo as well as ‘LeEco Inside’ tagline. Rest of the design is exactly the same as the Le Pro 3. The website reveals that there will be different color options like gold, white, silver, blue, black etc.

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